Our Expertise, Your Competitive Edge
ArcanaSemi isn't about flashy promises—we deliver proven, practical solutions, backed by a strong track record of successful SoC tapeouts and IP hardening projects across nodes from 16nm to 5nm.
Our team of industry veterans works side-by-side with you to ensure every step of the physical design flow is optimized for faster conversions and on schedule tapeout.
Learn MoreAddressing Your Core Challenges
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Design Closure and Time-to-Market
Our detailed and methodical approach—from SDC constraints, synthesis, and timing analysis to signoff—minimizes design iterations and ensures a faster, smoother transition from RTL to GDSII. We work collaboratively with your team to identify and resolve potential bottlenecks early in the design cycle.
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Optimizing Power, Performance, and Area
Achieving the right balance in power, performance, and area is a key challenge. Our specialized flow development and rigorous root cause analysis help meet your PPA goals, ensuring that every design decision supports your chip's key metrics
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Ensuring Robustness and Signoff Closure
From floor planning and placement to CTS and routing, our physical design services are built for signoff confidence. We focus on design closure with fewer iterations — minimizing downstream surprises and ensuring a smooth handoff to the foundry
Experience You Can Count On
Synthesis & Timing Analysis
We leverage our rich experience in SDC cleanup, optimized synthesis techniques, and static timing analysis to create a strong foundation that meets your PPA goals—reducing the need for costly late-stage revisions and closure challenges.
Floorplanning & Feasibility
Our floorplanning expertise includes robust power planning and feasibility assessments, ensuring that your layout is optimized for performance, power, routability, and manufacturability from the outset.
Placement & Clock Tree Synthesis (CTS)
With a keen focus on signal integrity and timing optimization, our team designs placement strategies and clock distribution networks optimized for performance and low power, ensuring they meet your design’s operational and PPA goals.
Routing & Signoff Preparation
By addressing challenges such as electromigration, IR drop, and DRC/LVS early in the process, we deliver clean, reliable routing solutions that streamline the final, foundry-driven signoff.
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Turn Your Engineering Challenges into well-designed solutions
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